Dielectrophoretic Assembly of Carbon Nanofiber Nanoelectromechanical Devices

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Detectors
materials processing
microelectromechanical systems
microresonators
nanotechnology

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Evoy, Stephane
Riegelman, Michael A
Naguib, Nevin
Ye, Haihui
Jaroenapibal, Papot
Gogotsi, Yury

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Abstract

We report a technique for the assembly of bottom-up nanomechanical devices. This technique employs the dielectrophoretic manipulation of nanostructures within a multiple layer lithography process. Mechanical resonators were specifically produced by assembling and clamping tubular carbon fibers onto prefabricated pads. Our preliminary results showed that an assembled cantilevered fiber with length L = 5 µm and width of W = 180 nm possessed a resonant frequency of f = 1.17 MHz. A shorter L = 3-µm-long singly clamped resonator of similar width showed a resonance of f = 3.12 MHz. This frequency range is in agreement with the low gigapascal bending moduli previously reported for carbon structures showing extensive volume defects. This technology would allow the integration of bottom-up nanostructures with other more established fabrication processes, thus allowing the deployment of engineered nanodevices in integrated systems.

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2005-09-01

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Copyright 2005 IEEE. Reprinted from IEEE Transactions on Nanotechnology, Volume 4, Issue 5, September 2005, pages 570-575. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Pennsylvania's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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