Zhong, JihuaBau, Haim H2023-05-222023-05-222001-10-012007-11-06https://repository.upenn.edu/handle/20.500.14332/39822Focuses on the importance of ceramic tapes as a substrate material for hybrid microelectronic circuits. Fabrication of thermal reactor; Importance in monitoring temperature; Utilization of layered manufacturing and rapid prototyping processes.Ceramaic MaterialsIndustrial ApplicationsMicroelectronicsThick Film Thermistors Printed on Low Temperature Co-fired Ceramic TapesArticle