Sen, SamagataBose, SauravSethi, Shubham2023-05-232023-05-232017-10-232017-10-23https://repository.upenn.edu/handle/20.500.14332/45864The present technical note reports troubleshooting on the sample preparation for SU-8 to SU8 wafer level bonding, using Microchem SU-8 2050 and SU-8 dry film (SUEX). The SU-8 film spin coated from Microchem SU-8 2050 viscous solution suffers from uneven surface and edge bead that lower the yield of wafer level bonding. On the other hand, although the SU-8 dry film does not show such problems, the partial delamination of the SU-8 film on the glass wafer, the proximity effect on the glass wafer, and the cracking in the SU-8 film are observed. These issues are shown to be solved by optimizing the UV light intensity and the baking temperature.http://creativecommons.org/licenses/by-sa/4.0/SU-8film stressWafer level bondingEngineeringLife SciencesMedicine and Health SciencesPhysical Sciences and MathematicsReport