Characterization of Silicon Dioxide (SiO2) and Microchem S1800 Resist Etching Using Oxford 80 Plus RIE

Azadi, MohsenMetzler, MeredithLopez, Gerald G2023-05-232023-05-232016-10-062016-10-06https://repository.upenn.edu/handle/20.500.14332/45846This technical report describes the process of etching silicon dioxide (SiO2) and Microchem S1800 resist using the Oxford 80 Plus Reactive Ion Etch (RIE) system.Nanoscience and NanotechnologyCharacterization of Silicon Dioxide (SiO2) and Microchem S1800 Resist Etching Using Oxford 80 Plus RIEReport